19-inch Rack Grounding Busbar / 100% Copper / 550A / Red Insulators / 0.64 cm (0.25 in) / J-STD-607-A
- $ 1,299.00
- Brand: LINKEDPRO BY EPCOM
- Availability: In stock
- SKU: LP-BUS-RACK
J-STD-607-A · ANSI/TIA-607-B LPBUSRACK TGB Grounding busbar for 19' rack · Electrolytic copper · 550 A continuous Specifications Material 100% Electrolytic copper Capacity 550 A continuous Dimensions 48.26 × 2.54...
Tags: categoria:Cableado Estructurado , marca:LINKEDPRO BY EPCOM , proveedor:Syscom , sku:LP-BUS-RACK , supplier:Syscom , syscom
J-STD-607-A · ANSI/TIA-607-B
LPBUSRACK
TGB Grounding busbar for 19' rack · Electrolytic copper · 550 A continuous
Specifications
Application
Telecommunications Grounding Busbar (TGB).
Designed for installation in 19' racks in telecommunications rooms (TR) as a bonding point for bonding conductors (BC) coming from the building's TBB.
Distributes ground to active equipment in the cabinet: switches, routers, NVRs, TVSS suppressors, cable trays, and metal cabinets.
For sites with a centralized TMGB, refer to the LPBUSMURO (main wall-mount bonding bar, 1000 A).
Installation
Actionable data, not generic recommendations.
Standards
Documented compliance.
J-STD-607-A
Commercial Building Grounding and Bonding Requirements for Telecommunications
ANSI/TIA-607-B
Generic Telecommunications Bonding and Grounding for Customer Premises
NOM-022-STPS
Static electricity in workplaces
NOM-001-SEDE
Electrical installations (utilization)
Package contents