0.031" 63% Sn / 37% Pb Solder Spool, 454 g.
- $ 2,399.00
- Brand: SYSCOM
- Availability: 6 In stock
- SKU: 488-SO-162
Product Features Solder core made with an activated resin base with excellent wetting action Residue removal method: Not required for most applications Complies with specifications: ROM1 per J-STD-004 Use on:...
Tags: categoria:Herramientas , Ferretería y Material Eléctrico , marca:SYSCOM
Product Features
- Solder core made with an activated resin base with excellent wetting action
- Residue removal method: Not required for most applications
- Complies with specifications: ROM1 per J-STD-004
- Use on: platinum, gold, copper, tin solder, palladium, silver, nickel, cadmium, brass, lead, bronze, rhodium, beryllium
- Flux: 44
- Flux %: 3.3%
- Body: 66 Regular; 63% tin, 37% lead alloy; (Lead)
- Contains lead and halogen
- Diameter: .031 inches/0.80 mm
- 21 gauge; 1 lb spool